A high reliability semiconductor laser chip manufacturer WINCO Semiconductor has completed 5 million yuan in angel round of financing, this round of financing will be used for product research and development, procurement of key process equipment and FAB construction.
WINCO is committed to the R&D and manufacturing of high-reliability semiconductor laser chips, focusing on the high-end market (optical communication, lidar and other fields) in the optoelectronic industry chain, providing high-performance and high-reliability products and services for customers at home and abroad.
INCO brings together world-class technical experts in the fields of GaAs and InP, such as chip design, extension growth, FAB technology, module sealing, reliability and market development. The team has rich experience in mass production of 4-inch InP and 6-inch GaAs, and has the ability to build self-built extension growth and contactless FAB process. The company's team focuses on accelerating the resolution of laser chips and devices used for long-distance backbone optical networks in China, focusing on the research and development of core semiconductor laser devices such as self-driving LiDAR coherent light sources.
Source: Oceanpine Capital
